Wafer
Instrumented wafer sensors carry thermocouple or RTD elements on the wafer itself, to map temperature across semiconductor process equipment. PIC Engineering supplies Thermo Electric instrumented wafers, including RTD wafers, customised to the tool. Wafers are built to the size and number of measuring points the process needs, for semiconductor tool monitoring. See the Thermo Electric range.
Instrumented Wafer Temperature Sensors
Thermo Electric instrumented wafers carry thermocouples on the surface of a silicon wafer, where the most vital processes occur, rather than inside the wafer's core, for a faster and more accurate response. They are made for semiconductor processing equipment, where knowing and controlling the temperature at the wafer surface is critical, and can also map the temperature uniformity of any other two dimensional surface.
One range, six models: TC-350 and TC-700 in a high performance (H) or heavy duty (D) build, the TC-1200 for high temperature and high purity up to 1,200 °C, and the BTC700H bonded wafer pair for wafer bonding equipment. Standard wafers from 50 to 300 mm, with the number and position of the thermocouples built to your process.
RTD Wafer Sensor
RTD — Low Temperature / High Accuracy — Instrumented Wafer Resistance Temperature Detectors (RTD’s) — Max Temp 240 C
The Instrumented Wafer RTDs operate under the principle that the electrical resistance of certain metals increases or decreases in a repeatable and predictable manner with a temperature range.
Capable of higher accuracy and increased stability than thermocouple wafers, RTD’s instrumented wafers provide additional options for monitoring of semiconductor fabrication equipment.
The ability of the RTDs sensors to maintain initial accuracy over an extended period of time provides repeatability in temperature measurements.
The BTC700 finds application in wafer bonding equipment where knowing and controlling temperature uniformity across mating silicon wafer surfaces is required. MEMS, MOEMS, silicon-on-insulator (SOI), wafer level packaging, and 3 dimensional chip stacking are the main technical categories where wafer bonding is employed.
Bonded Wafers can be fabricated from any wafer diameter so that a specific bonding process can be followed as close as technically possible. As a user of this product, you can expect rapid, accurate, and reliable response to temperature changes that occur during the wafer bonding processes.
Not only does this allow for high temperature operation, but it also creates one of the cleanest designs available. By eliminating the bonding agents there is no possibility of out gassing or other undesirable conditions.
This design finds application where knowing and controlling the temperature at the surface of a silicon wafer is critical. Most manufacturers embed their sensors within the wafer’s core. This product focuses its measurement at the wafer’s surface where the most vital processes occur. In using this product you can expect faster and more accurate response times resulting from the most accurate placement of the sensing elements.
While these products are typically used throughout the semiconductor industry, thi
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Medium, range, temperature and connection is all we need. Wafer is a fraction of what the 14 principals build, and anything they list we can quote.